融合卷积网络和下采样的半导体缺陷检测方法
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河南科技学院

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河南省科技攻关项目(242102110014);河南省高等学校重点科研项目服务产业发展专项计划(25CY010)


A semiconductor defect detection method integrating convolutional networks and downsampling
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1.College of Mechanical and Electrical Engineering;2.Henan Institute of Science and Technology

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    摘要:

    针对工业中三极管表面检测中存在的细小缺陷、无规律缺陷以及缺陷不明显等问题,提出了基于YOLOv11-MRW的三极管缺陷检测算法。首先,本文将将轻量级视觉模型架构Mambaout与大卷积核网络UniRepLKNet相融合,代替原YOLOv11模型的C3K2中,轻量化高效推理适配图像分类,使得不同尺度的特征提取能力得以提高,还增大了感受野;引入了RFD下采样模块两个变体,提高不同阶段的特征提取能力,有效解决传统卷积所导致的小目标信息丢失问题;通过采用WIoUv2边界框损失函数,简单样本对损失值的贡献被有效控制在较低水平,模型的训练重心得以从简单场景转移到遮挡目标上,使得遮挡目标的检测精度获得了更为明显的提升。试验结果表明,YOLOv11-MRW相较于基础模型的mAP@0.5和mAP@0.5-0.95分别提升了1.2个百分比和10.6个百分比,在实际应用中针对细小缺陷的表面检测有一定的研究价值,为提高三极管等芯片的准确度研究提供了有力的支撑。

    Abstract:

    Aiming at the problems of fine defects, irregular defects and indistinct defects in the surface inspection of transistors in industry, a transistor defect detection algorithm based on YOLOv11-MRW is proposed. Firstly, this paper fuses the large convolution kernel network UniRepLKNet with the lightweight gated depthwise convolution model Mambaout to replace the C3K2 in the original YOLOv11 model, which enables lightweight and efficient inference for image classification, improves the feature extraction ability at different scales, and increases the receptive field. Two variants of the RFD downsampling module are introduced to enhance the feature extraction ability at different stages, effectively solving the problem of small target information loss caused by traditional convolution. By adopting the WIoUv2 bounding box loss function, the contribution of simple samples to the loss value is effectively controlled at a low level, and the training center of the model is shifted from simple scenes to occluded targets, resulting in a more significant improvement in the detection accuracy of occluded targets. Experimental results show that compared with the basic model, the mAP@0.5 and mAP@0.5-0.95 of YOLOv11-MRW have increased by 1.2% and 10.6% respectively. In practical applications, it has certain research value for the surface detection of fine defects and provides strong support for improving the accuracy of transistors and other chips.

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  • 收稿日期:2026-02-13
  • 最后修改日期:2026-04-21
  • 录用日期:2026-04-24
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