To solve the problem of large overall size caused by discrete packagin g of semiconductor DFB laser and LiNbO₃MZ modulator,the adoption of hybrid int egrated packaging of semiconductor MZ modulaotor and DFB laser is expected to si gnificantly reduce the overall size of the transmitter module.This paper propos es an overall layout structure according to the requirements of chip and module size,and chooses the optical coupling scheme of double lens with isolator and t apered lens fiber and the microwave coupling scheme of microstrip line to GCPW. Through simulation mothods,the key parameters and tolerance of hybrid integrate d design of laser and modulator in the module are researched.The hybrid integra ted transmitter module not only has miniaturized size and structure,but also en sures its own good stability and reliability.