In order to better solve the heat dissipation of high-power light-e mitting diode (LED) and facilitate its integration,an active and passive combination method is proposed based on dual synthetic jets and a fin.The comparative analysis of four different heat dissipation methods is executed on t heir heat dissipation characteristics. The heat dissipation characteristics of dual synthetic jets (DSJs) are investiga ted on different LED powers and jet-to-surface distances,and compared with those of the commercial LED product.The results indicate that the chip temperature rapidly decreases and tends to be stable usin g DSJ single cooling,but the stable temperature is about 9.8℃ higher than that using the commercial fin.However,t he heat dissipation effect is significantly enhanced and the stable temperature further drops 15℃ using the combination structure with respect to the commercial fin.The effects of jet-to-surface distance on the heat diss ipation performance of DSJ are roughly consistent,and an optimal cooling effect is achieved when the jet-to-surface distance is about 20mm for LED array chips with different powers.In addition,the effect of jet-to-surface distanc e on the combination structure is complicated but not remarkable.The stable temperatures decrease within 14.4℃－24.4℃ using the combination structure at different jet-to-surface distances compared with the commercial L ED product,which demonstrates that the combination structure not only can enhance the heat dissipation effect for t he LED array chips,but also make the installation more flexible,thus to effectively reduce the installation space of the heat dissipation structure.