快速热退火温度对纳米晶氢-硅薄膜及其p-n结性能的影响
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沈鸿烈(1958-), 博士,特聘教授,博士生导 师,主要从事新型光电薄膜材料与光伏器件的研究.

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国家高技术研究发展计划(863)计划(2006AA03Z219)、中央高校基本科研业务费专项资金、 江苏高校优势学科建设工程和江苏省普通高校研究生科研创新计划(CXZZ11_0206)资助项目 , 陈伟龙, 尤佳毅 (南京航空航天大学 材料科学与技术学院,江苏 南京 211100)


Effect of rapid thermal annealing temperature on properties of nanocrystalline S i:H films and nanocrystalline Si:H based p-n junction
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    摘要:

    采用快速热退火(RTA)对热丝化学气相沉积HWCVD制 备的非晶氢-硅(a-Si:H)薄膜进行晶化处理,并在此基础上制备了 纳米晶氢-硅(nc-Si:H)薄膜p-n结。利用拉曼(Raman)光谱、X射线衍射(XRD)、 扫描电子显微镜(SEM)和分光光 度计研究了所制备(nc-Si:H)薄膜的结构、光学性能与退火温度的关系;同时, 研究了不同RTA条 件下制备p-n结的整流特性随温度变化的规律。研究发现,随RTA温度由700℃升高至 1100℃,薄膜的晶化率由46.3%提高到96%,拉曼峰半高宽(FWHM)由19.7cm-1降低至7. 1cm-1。当退火 温度为700℃时,薄膜的XRD谱中只有一个较弱的Si(111)峰;当退火 温度高于900 ℃时,薄膜 的XRD谱中除Si(111)峰外,还出现了Si(220)、Si(311)峰。同时,随退火温度的升高,薄膜 的禁 带宽度由1.68eV升高至2.05eV。由于禁带宽 度的增加,相应的p-n结最高工作温度也由180℃升高至300℃。

    Abstract:

    Nanocrystalline Si:H films and nanocrystalline Si:H film based p -n junctions were fabricated by rapid thermal annealing (RTA) of amorphous silicon films deposited by hot-wire chemic al vapor deposition.Dependence of the structural and optical properties of the nanocrystalline Si:H films on the annea ling temperature is studied by Raman spectroscopy,X-ray diffraction,scanning electron microscopy and spectrophotomet er.The temperature dependent I-V characterization of the junctions is also studied.The Raman results show that the crystalline fraction of the films is gradually increased from 46.3% to 96%,and the full width at half maximum (FWHM) is gradually decreased from 19.7cm-1 to 7.1cm-1 as the RTA tem perature is increased from 700℃ to 1100℃.The X-ray diffraction results show that at the annealing temperature of 700℃,only a small peak corresponding to the Si(111) plane is observed in the spectrum. In contrast,as the annealing temperature increasing above 900℃,the spectra of the nanocrystalline silicon films show Si(111),Si(220) and Si(311) orientations.At the same time,the band gap of the de posited nanocrystalline silicon films is increased from 1.68eV to 2.05eV as the RTA temperature increasing from 700℃ to 1100℃.On the other hand,with the increasing of the band gap,the highest working temperature of the correspon ding p-n junctions is gradually increased from 180℃ to 300℃.

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张磊,沈鸿烈,陈伟龙,尤佳毅.快速热退火温度对纳米晶氢-硅薄膜及其p-n结性能的影响[J].光电子激光,2013,(10):1930~1935

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  • 收稿日期:2013-03-02
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