Organic light emitting diodes (OLEDs) h ave kept attracting many researchers′ attention due to the distinct ad vantages and huge potential application prospect.Rapid developments in the electric al and optical performance of OLEDs have been obtained and the reliability problems have been s olved to a certain degree by advanced packaging approaches.However,the thermal management is still the key is sue limiting the reliability of OLED considering the temperature sensitivity of organic materials and the low th ermal conductivity of composing materials.In this paper, infrared (IR) thermal tracer and transient thermal tester are combined to evalua te the thermal performance of OLED.It is found that the increase of junction temperature can lead to the decr ease of driving voltage.The temperature gradient up to more than 30℃ in the OL ED panel is o btained at the input current of 100mA.The peak temperature from IR imager test is higher than that obtained from e lectrical test method,and the thermal difference between them is not a constant when changing the inpu t power.Based on the analysis of intrinsic properties of the two approaches,it is pointed out that the combination of them can offer more meaningful data for further device layout optimization.