A novel method by using 3D parameters is presented to measure line edge roughness(LER).Single-side surface profiles (sidewall) are acquired using atomic force microscope(AFM).The single-side surface is reconstructed according to AFM working mechanism and measurement characters,and the reference plane is defined by regression theory.In line with integrated circuit development,as well as practical requirements in the semiconductor and lithography industry,a group of 3D-LER parameters are proposed to describe ...