| 赵玛利,刘铁根,江俊峰,王萌.添加Cu-Cr络合物的高分子聚合物的红外激光诱导表面金属化研究[J].光电子激光,2015,26(7):1328~1335 |
| 添加Cu-Cr络合物的高分子聚合物的红外激光诱导表面金属化研究 |
| Study on the surface metallization of Cu-Cr complexes-doped high molecular pol ymer induced by infrared laser |
| 投稿时间：2015-02-08 |
| DOI： |
| 中文关键词: 激光表面改性 Cu-Cr络合物 红外激光 高分子聚合物 化学镀 |
| 英文关键词:laser surface modification Cu-Cr complex infrared laser high molecular polym er chemical plating |
| 基金项目:国家重点基础研究发展计划(2010CB327802)、国家重大科学仪器设备开发专项(2013YQ030915)、国家自然科学基金(61475114、61227011、61378043、11004150、61108070)、教育部科学技术研究重大项 目(313038)、天津市自然科学基金(13JCYBJC16200)和深圳市科技创新(JCYJ20120831153904083)资助项目 (1.天津大学 精密仪器与光电子工程学院,光电信息技术教育部重点实验室,天津 300072； 2.南开大学 物理科学学院光子学中心,天津 300074) |
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| 中文摘要: |
| 对添加Cu-Cr络合物的高分子聚合物红外激光诱 导表面金属化进行了实验研究,利用1.06μm 和10.60μm激光对材料进行表面改性处理,并通过多种表面检测方 法对改性后的样品进行了分析。结果表 明,1.06μm激光可使材料表面产生大量起到“锚固作用”的微孔, 并且样品表面呈现周 期性起伏结构,表面增附效果较强,1.064μm激光可打破Cu-Cr络合物的化学键,在改性 区域出现还原性Cu1＋和Cr3＋,含量分别为0．9％和2.8%,激光处理 后得到的镀层平均厚为1100μm,标准差为0.29μm,且镀层附 着力较大；而10.60μm激光处理后样品表面呈随机起 伏结构,表面Cu1＋和Cr3＋的含量分别为0．4％和1．6％,镀层平均厚度为1.70μm,标准差为0. 59μm,且镀层附着力较小。 |
| 英文摘要: |
| The surface metallization of Cu-Cr complexes doped high molecular pol ymer induced by infrared laser is studied in this paper.The surface modifying process was acco mplished by 1.06μm and 10.6μm infrared lasers,and the microstructure and the chemical pr operties of the modified areas are analyzed by many surface detection methods.The experimental results show that the ablation effect of the 1.064μm laser beam leads to the formation of a large number of holes, which plays the role of "anchoring" on the irradiated surface.The modified a reas after irradiation by 1.06μm laser show a periodic structure,leading to an increased surf ace adhesive force. The 1.064μm laser beam can break the chemical bonds of the Cu-Cr complexes,re sulting in the emergence of the reduction ions of Cu1+ and Cr3+ in the modified region,and the contents of the Cu1+ and Cr3+ ions are 0.9% and 2.8%,respectively.The average thickn ess and standard deviation of the deposited copper layer after irradiation by 1.064μm laser are 1100μm and 0.29μm,respectively.By contrast,a random fluctuated structure was formed after irradiation by 10.60μm laser beam,and the contents of Cu1+ and Cr3+ ions are 0.4% and 1.6%,respectively.The av erage thickness and standard deviation of the deposited copper layer after irradiation by 10.6μm laser are 1.7μm and 0.59μm, respectively,and the adhesive force of the copper layer is lower than that irrad iated at 1.060μm. |
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